This is a very complex process, and this post will list some multilayer PCB fabrication process topics.
We will discuss those multilayer PCB fabrication process topics in the next days.
So please notice our MCPCB fabrication website update.
Note:
We will every multilayer PCB fabrication process topic above mention, and will build links after discussed.
I will recommend you have to make a bookmark for this post, then you will get the full introduce multilayer PCB fabrication process content.
Now David will list the full multilayer PCB fabrication process below:
Dry-film Resist Coating
Inner Layer Core Material
Photo Tools or Artwork
Image Expose
Image Develop
Inner Layer Etch
Resist Strip
Automated Optical Inspection or AOI
Oxide Coating
Multilayer Construction
Copper Foil
PrePreg or Preimpregnated Bonding Sheet
Laminated Panels
Here is the mass production multilayer PCB fabrication process topics:
Primary or First Drill
Debar
Desmear – Multilayer Boards Only
Electroless Copper Deposition
Dry-film Resist Coating Outer Layer Panels
Outer Layer Expose & Develop
Copper “Pattern”Plate
Tin Plating
Resist Strip
Etch
Tin Strip
Clean and Prep for Solder Mask
LPI Solder Mask Application
Solder Mask Cure
Legend, Silkscreen, Nomenclature, Component Designator
Hot Air Solder Leveling (HASL)
Rout, Fabrication, Score, Bevel
Bare Board Electrical Test
Final Inspection
Packaging and Ship
