The rigid PCB manufacturing process of Plated Gold Nickel

In this paper we are going to discuss Gold Nickel Plated.
Some guys also named this surface finish as electroless gold over nickel.
It’s can meet RoHS compliant surface finishes.

Why we need Plated Gold Nickel on the rigid PCB?

You know the copper component pads and holes surface is the key factor of the rigid PCB SMT process.
The Gold Nickel Pleated technology can provide clear of solder mask pads and holes.
Then the SMT worker can apply a soderable surface finish to protect the copper until the components are soldered onto the board.

Three manufacturing process of Plated Gold Nickel

There were some different compared with other surface finish technologies.
Because the Gold Nickel plated through chemical method.
Firstly, use chemically deposit nickel onto the copper.
Secondly a thin coating of gold over the nickel.
The last step, moving the panels through a series of tanks which clean and sensitise the copper surface.
Then deposit about 5 microns of nickel and a tenth of a micron of gold.

Gold Nickel plated can meet RoHS 2.0 compliant

First of all we should know the RoHS 2.0 compliant definition.
RoHS is short for the EU Reduction of Hazardous Substances.
According to EU legislation, all of rigid PCB cannot use lead.
That is the reason why more electronic engineers choose Gold over Nickel surface finish.
In fact, similar with this surface finish, Silver over nickel also can meet RoHS 2.0 compliant.
This is used the similar manufacturing process to deposit a sterling silver finish, or lead free hot-air levelling.
Just use silver instead of gold during the deposit manufacturing process.