The lamination copper process of multilayer rigid PCB
Now most of multilayer rigid PCB manufacturing process through Automative machine operating.
The laminate copper process also has this character.
So this paper Emma wants to discuss the lamination process of multilayer rigid PCB.
The prepare of the laminate copper process
You know laminated copper process should use the press operator machine.
The worker will load the copper panel on the bed of base plate.
This means the workers should build up at least three panels on the base plate in the same way.
But the exact number should depend on PCB designers Gerber file.
Here is one of china multilayer rigid PCB laminate copper prepares process.
The workers roll the heavy stack under a press sheet.
So the lower down the steel top plate.
The pins the stack together to maker sure those copper panels align.
And the rolls finished stack out of the lean room into a rack.
This time use the press operate automotive laminate machine collect 3 stacks on a loader and the loads them into the bonding press.
The theory of multilayer PCB laminate process
Most people just know the laminate copper process use automative press machine.
But how to laminate the copper to maker sure permanent bonding?
4MCPCB experts told Emma that most press machines have heated press function.
Through the heated press plates and pressure to bond the layers of the PCB together.
Also the heat melts and the cures the epoxy resin in the prepreg.
This is very complex and fast process, so most press machines are computer controlled.
The multilayer PCB designers have set the data that build up the heat and the pressure correctly, hold it and then to cool the press down.
In this laminate copper way, usually can ensure a permanent bond that will last the lifetime of the PCB.
A laminated copper process example
End of this paper, Emma want to discuss a 4 layer laminated copper process.
4 layer PCB board may the most simple multilayer PCB.
Why some rigid PCB factory don’t want manufacturing 4 or more multilayer PCBs?
The most reason is the laminated copper precesses are more complex than one or two side rigid PCB board.
And also must control the thickness of the board.
Usually the 4 laminated thickness is less than 50 micrometers for normal applications.
But in defence, or avionic applications can have more than 50 micrometers.
The clean step of the laminated copper process
Like most other rigid PCB manufacturing steps, we should clean the surface at end process.
Once the cycle is completed, means the laminated copper process have finished.
So the workers should unloads the press and carefully rolls the heavy stacks.
Then remove the top plate and move the copper panel to clean room.
It’s important that the worker unloads each of the copper panels from the stacks.
Then removing the aluminium press plated used to ensure a smooth copper finish.
Or the copper panel should be reworded.
This time the laminated copper foil is bonded, and prepared to image outer circuit layers.