You should know the B-stage of PCB board definition
Why we should learn the B-stage definition?
Recent weeks ago, some friends asked some B-stage of PCB board questions.
Emma have searched on Google, but none good result,.
Then ask some 4MCPCB colleague, then get some idea about the B – stage of PCB board.
For most normal PCB guys, B-stage is a strange definition.
This paper just discus some simple definition of B-stage of PCB board, or contact us to learn more.
Why is B-stage Important?
Partially cured epoxy, or B-staged epoxy adhesive, does have processing advantages.
The adhesive can have its initial application and, partial cure in one location, and its final cure in another location days later.
In short, B-stage epoxies are typically considered and ultimately chosen for process assembly reasons, rather than technical or performance reasons.
A resin in an intermediate state of cure. The cure is normally completed during the laminating cycle.
4MCPCB experts explain B-stage of PCB board
( Prepreg) Partially cured resin (mostly reinforced with glass cloth) which will soften under a special range of temperature and which can be used to bond together cured laminate sheets to form a multi-layer board.
B-staged epoxy resin is a descriptive term used to define a one component epoxy system, using a latent (low reactivity) curing agent.
This unique product can be partially cured (sometimes referred to as “pre-drilled”), as an initial stage after being applied onto one substrate/surface.
It can, at a later time, be completely cured under heat and pressure.
This is significantly different from a typical A-stage epoxy system that is provided in a one or two component format and, is cured in one step at ambient or elevated temperatures.